3DVIA Composer @ TEKOM tcworld conference 2009

TEKOM

This week in Weisbaden, Germany — it’s the 2009 tcworld conference, running from November 4th to 6th.

3DVIA Composer will be seen in several booths this year. Here are the booths for our direct resellers:

  • DS Booth, with our partner TransCAT: HAll 3 stand 332
  • SolidPro: Hall 3 stand 333
  • Datasquare: Hall1 stand 101-102
  • Kisters: Hall 4 stand 400

In addition, the following partners will be showing 3DVIA Composer as part of their offerings: 

  • TID Informatik: Hall 4 stand 448
  • Docware: Hall 4 stand 460

Be on the watch out for the poster that our partners will be using to help you easily identify 3DVIA Composer at their booths.

 

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