Author Archives: Garth

Introducing the latest release of 3DVIA Composer!!!

It’s here, just in time for the holidays… Santa has visited us early and stuffed our software stockings with another impressive release of 3DVIA Composer, full of breakthrough technology and fun-to-use features. You could shake the box and try to guess what’s inside… or take the easy way and watch the preview for more info.

My personal favorite new feature is Smart Outlines. What’s yours?

Enjoy!

TodCast #4: Custom Color Silhouettes

Have you ever wanted to make a technical illustration using non-black silhouette outlines for specific parts? It’s incredibly easy and fast to do, as Tod demonstrates in this latest TodCast.

Some goodies in the current version of 3DVIA Composer V6R2012…

Hi! Since we are just about to release 3DVIA Composer Version 6 Release 2012x, I thought it would be good to review some of the good stuff that was jam-packed into the previous release 6 months ago, V6R2012.

Enjoy, and stay tuned for more!

The Hardest 3D Puzzle in the World?

Ok, I’ve seen some of those puzzle brain teasers… but this one take the prize for the most difficult! Thankfully 3DVIA Composer is there to the rescue!

Thanks to the crew at CAPINC for putting this together and sharing it on YouTube.

3DVIA 3D Communication Strategy Forum

At this year’s Dassault Systèmes Customer Conference (DSCC 2011), we will be launching our first-ever strategy forum for 3DVIA.

Click here for more details about the forum and DSCC.

3DVIA 3D Communication Strategy Forum – November 10, 2011

Immediately following DSCC 2011, 3DVIA will be hosting the 3D Communication Strategy Forum. This half-day event is designed to promote an open dialogue and exchange of ideas between 3DVIA product leaders and industry representatives who are interested in exploring the use of 3D product communications.

Open to all Dassault Systemes’ customers attending DSCC, the forum will provide attendees with a detailed 3DVIA brand and product strategy, along with an exclusive preview of upcoming 3DVIA mobile and cloud solutions. This will be followed by panel discussions on overcoming obstacles and establishing optimum workflows in enterprise 3D product communications.

Please Note: The 3DVIA 3D Communication Strategy Forum is a complimentary event open to current DS customers and prospective customers attending DSCC 2011. Registration will be limited to the first 20 individuals who register and attendance must be secured through the official DSCC 2011 registration site. Acceptance of the DSCC non-disclosure agreement will be mandatory for all attendees.

We hope to see you there!