This year’s Collaboration and Interoperability Congress event will be held May 23-25 in Denver, Colorado. 3DVIA will be there in full force just like in previous years, to engage in conversations about improving the usability of 3D data in downstream applications and usages. Be on the lookout for Gideon and Kyle to answer any of your questions!
What exactly is the 3DCIC? Here’s the description from their website:
…brings together experts and executive decision makers from automotive, aerospace, heavy equipment, electronics and other discrete manufacturing industries, along with representatives from government and the defense community.
Attendees take part in a diverse choice of breakout sessions and lively panel discussions offering direct interaction with industry experts who deeply unde...